Solder Secret

Solder Secret. How to solder ???

Solder Joint Reliability Prediction for Multiple Environments (Hardcover)

“Solder Joint Reliability Prediction for Multiple Environments” will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be [...]

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science) (Hardcover)

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples [...]