Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (Hardcover)
This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry’s need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, [...]