Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science) (Hardcover)
Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples [...]