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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (Hardcover)

Posted on | October 19, 2009 | No Comments

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

This new volume by interconnection expert on solder joints, Johns H. Lau, deals with BGA, CSP, Flip Chips, and other new technologies that underlie the electronics industry’s need for smaller, faster products. Naturally, as ever-smaller products are created, the reliability of the solder joints that bind them becomes increasingly crucial. Balancing concepts and practical applications, the authors explain the fundamentals of solder joint reliability and present creative, robust packaging techniques for cost-effective interconnection.

From the Back Cover
The explosive growth of high-density packaging has created a tremendous impact on the electronic assembly and manufacturing industry. Ball grid array (BGA), chip-scale pack (more…)

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