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Is SPI the yield improvement tool we’ve waited for? How SPI cut defects by 80% at an automotive electronics plant, plus a primer on how it works.(Solder … An article from: Circuits Assembly [HTML] (Digital)

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Is SPI the yield improvement tool we've waited for? How SPI cut defects by 80% at an automotive electronics plant, plus a primer on how it works.(Solder ... An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by Thomson Gale on April 1, 2007. The length of the article is 1807 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Digital Locker immediately after purchase. You can view it with any web browser.Citation DetailsTitle: Is SPI the yield improvement tool we’ve waited for? How SPI cut defects by 80% at an automotive electronics plant, plus a primer on how it works.(Solder Paste Inspection)Author: Matthew T. HolzmannPublication: Circuits Assembly (Magazine/Journal)Date: April 1, 2007Publisher: Thomson GaleVolume: 18 Issue: 4 Page: 28(4)Distributed by Thomson Gale

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