Solder Secret

Solder Secret. How to solder ???

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science) (Hardcover)

Posted on | October 7, 2009 | 1 Comment

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science)

Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS® that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion. The add-on package along with the examples make it possible for an engineer with a working knowledge of ANSYS® to perform solder joint reliability analysis. Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® allows the engineers to conduct fatigue reliability analysis of solder joints in electro (more…)

Related posts:

  1. Solder Joint Reliability Prediction for Multiple Environments (Hardcover) “Solder Joint Reliability Prediction for Multiple Environments” will provide...
  2. Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science) (Hardcover) Solder joints are ubiquitous in electronic consumer products. The...
  3. Connections in Electronic Assemblies (Manufacturing Engineering and Materials Processing) (Hardcover) No description for this product could be found, but have...
  4. Soldering for Electronic Assemblies (Manufacturing Engineering and Materials Processing) (Hardcover) No description for this product could be found, but have...
  5. Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics (Hardcover) Review From the reviews: “The main part of the...

Related posts brought to you by Yet Another Related Posts Plugin.

Category: How to solder
Tags: > > > > > > > > >

Comments

One Response to “Fatigue Life Prediction of Solder Joints in Electronic Packages with ANSYS® (The International Series in Engineering and Computer Science) (Hardcover)”

  1. Luthando
    October 7th, 2009 @ 3:40 pm

    This text is a gem. The included add-on package for ANSYS alone is worth twice the price of this book. The reader is first introduced to the theoretical basis of fatigue life prediction, a rather thorough survey of research done in the electronic packaging field. The chapters that follow explain step by step how a detailed FEA model can be created very efficiently using the provided addon package called ReliANS. Highly recommended for any engineer wanting to exploit ANSYS for more reliable package design, and others who wish to improve on their current methods.

Leave a Reply